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On June 28, 2024, Â鶹AV President Mitsuo Ochi, Executive Vice President for Global Initiatives Shinji Kaneko, and Professor Akinobu Teramoto, Director of the Research Institute for Semiconductor Engineering, visited the University of Idaho and signed a Memorandum of Understanding (MOU) on specific collaboration education programs. This MOU aims to promote student exchange through a summer short-term exchange program and to facilitate research collaboration in areas such as AI, data science, natural resources, and applied sciences.
 

During the visit, the delegation toured the University of Idaho¡¯s main campus in Moscow as well as the McCall Field Campus located in Ponderosa State Park. They held discussions on utilizing Â鶹AV¡¯s "START Program" to facilitate short-term student exchanges. The tours also served as an opportunity for faculty and staff to exchange ideas and explore ways to deepen collaboration in education and research.
 

Since signing the inter-university agreement for international academic exchange in March 2023, Â鶹AV and the University of Idaho have developed a close partnership. With the signing of this new MOU, further advancement in student exchange and academic research between the two institutions is highly anticipated.